Xilinx unveils small Artix and Zynq hardware for IoT, industrial vision and more
Xilinx announced Tuesday new Artix and Zynq UltraScale + chips that are 70% smaller than traditional chips for cameras and other devices used in industrial, vision, healthcare and other markets.
The new hardware is based on 16 nm technology and is based on the Integrated Fan-Out (InFO) packaging process from TSMC for high computing density and performance per watt.
LUCID Vision Labs also announced that it has partnered with Xilinx to integrate a new UltraScale + ZU3 from the Zynq family into its next generation industrial vision camera called the Triton Edge. Using the ZU3 with InFO packaging, LUCID uses a new rigid-flex board architecture to “put an amazing amount of computing power into an ultra-compact, factory-hard IP67 camera,” said Rod Barman, President of LUCID, in a statement.
Industrial cameras are often used to analyze manufacturing processes to determine whether factory machinery is functioning properly or is showing signs of wear and tear. Packaged goods can also be quickly analyzed for defects in an assembly line.
The Zynq family with InFO packaging also includes ZU1 and ZU2 in the multiprocessing system-on-chip line. The ZU1 is designed for marginal connectivity, including IoT systems that could use embedded imaging cameras used for handheld testing.
The Artix UltraScale + is a family of Field Programmable Gate Arrays (FPGAs) that Xilinx has identified as ideal for image processing with advanced sensors, networks and ultra-compact 8K video broadcasting. The FPGAs have 16 Gbit / s transceivers for network, vision and video.
Both the Artix and Zynq families provide security used in other UltraScale + devices with countermeasures against RSA-4095 authentication, AES, CGM decryption, and differential power analysis. Xilinx also provides the IP of the security monitor, which the company claims adapts to security threats throughout the product lifecycle.
“Xilinx has taken a huge step forward in supporting more systems on the edge and embedding them in endpoint devices themselves,” Mandell said in an email. Xilinx was able to maintain the high-performance Xilinx processing capabilities of previous generations with the new Artix and Zynq devices with lower performance and smaller form factor.
“OEMs and systems integrators can easily add support for new workloads such as edge analytics, AI, virtualization, and new interfaces and protocols that fuel these workloads on their devices,” added Mandell.
“This provides an edge over some of the company’s FPGA competitors who are really good at low power consumption, but inconsistent with the Xilinx ecosystem and support, which are critical to supporting some of these relatively newer edge / embedded workloads Meaning, “said Mandell.
The first Artix units are expected to be in production in the third quarter, while the Zynq ZU1 units will begin sampling in the third quarter and mass production will begin in the fourth quarter. Pricing has not been disclosed but will be available through the Xilinx sales channel.
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